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发明授权
CN101989598B 多晶片封装 有权 转让

多晶片封装
摘要：
本发明涉及一种多晶片封装，具有多个引脚以及第一和第二半导体晶片，叠印并连接在一起，定义一个晶片堆叠。晶片堆叠具有相对的第一和第二边，每个第一和第二半导体晶片都带有栅极、漏极和源极区，以及栅极、漏极和源极接头。第一个对立边具有第二半导体晶片的漏极接头，漏极接头与第一套多个引脚电接触。第一半导体晶片的栅极、漏极和源极接头以及第二半导体晶片的栅极和源极接头，设置在第二个所述的对立边上，并与第二套多个引脚电接触。第一半导体晶片的源极引脚可以与第二半导体晶片的漏极引脚相同。
摘要（英）：

A multi-die package has a plurality of leads and first and second semiconductor dies in superimposition and bonded together defining a die stack. The die stack has opposed first and second sides, with each of the first and second semiconductor dies having gate, drain and source regions, and gate, drain and source contacts. The first opposed side has the drain contact of the second semiconductor die, which is in electrical communication with a first set of the plurality of leads. The gate, drain and source contacts of the first semiconductor die and the gate and source contacts of the second semiconductor die are disposed on the second of said opposed sides and in electrical communication with a second set of the plurality of leads. The lead for the source of the first semiconductor die may be the same as the lead for the drain of the second semiconductor die.

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