The invention discloses a method for dynamically adjusting chemically mechanical polishing (CMP) rate. The method comprises the following steps: collecting polishing data within a specific historical time period, wherein the data comprises off-line polishing rates which are measured multiple times within the time period, and polishing rates at the beginning and end of the time period; and calculating the polishing thickness adjusted quantity of the polishing of each time according to the historical data to evaluate and feed back the wear condition of the wearable parts in a CMP equipment, so as to adjust the polishing rate of the CMP equipment in time, so that the CMP equipment can always work at the constant polishing rate, thereby reducing the shutdown maintenance frequency and enhancing the work efficiency.