The present invention discloses a package carrier plate, a package structure and a manufacturing process of the package carrier plate. The package carrier plate comprises the following components: a dielectric layer, a patterned conductive layer, a plurality of conductive columns and a patterned welding-proof layer. The dielectric layer is provided with a first surface, a second surface which is opposite from the first surface, and a plurality of openings. The patterned conductive layer is inserted into the first surface of the dielectric layer. The conductive columns are respectively configured in the openings. The openings extend from the second surface of the dielectric layer to the patterned conductive layer. Furthermore the conductive columns are connected with the patterned conductive layer. The patterned welding-proof layer is configured on the first surface of the dielectric layer and exposes partial patterned conductive layer.