The invention discloses a micromechanical structure device production method taking tin as a sacrifice layer. The micromechanical structure device production method comprises the following steps of: realizing the surface planarization of the sacrifice layer by taking tin as the sacrifice layer and adopting a method for melting the tin by heating a substrate; etching the tin sacrifice layer by adopting a wet etching method so as to form the sacrifice layer; making various micromechanical structure patterns on the surface of the sacrifice layer, and then placing the substrate into dry ice liquid to enable the sacrifice layer to be powdered and separated from the substrate so as to realize that the suspension of a micromechanical structure. The sacrifice layer is removed by adopting a physical method without generating chemical etching action on materials of the suspended micromechanical structure, therefore the invention can enhance the qualification rate of the micromechanical structure device and is beneficial to large-scale production.