The invention discloses a curved surface package structure of a light-emitting semiconductor chip and a light-emitting semiconductor light source device thereof. The curved surface package structure comprises a three-dimensional bracket, two conductive electrodes, and a plurality of light-emitting semiconductor chips, wherein the three-dimensional bracket and the two conductive electrodes are fixedly assembled together; the three-dimensional bracket has at least one arc-shaped package curved surface; and the light-emitting semiconductor chips are attached on the package curved surface of the three-dimensional bracket circularly, and are electrically connected with the two conductive electrodes in the series and/or parallel manner. The curved surface package structure is easy to manufacture, and can acquire more uniform 360-degree luminous arc.