The invention discloses a manufacturing method of a surface mounted device (SMD) resistor. The method for manufacturing a positive electrode of the SMD resistor comprises the following steps: firstly, printing a resistive layer; secondly, printing and covering a positive auxiliary electrode at both sides of a position in which the resistive layer is close to the positive electrode; and thirdly, sputtering to form the positive electrode, thus ensuring the connectivity between the positive electrode and the resistive layer and strengthening the stability of a product. The positive electrode is used for sputtering a conductive material which takes silver as a main composition in a vacuum sputtering mode. The sputtered conductive material can be sputtered uniformly to a substrate surface. A sputtered electrode layer has the advantages of thin film and excellent uniformity, thus ensuring the uniformity of the film thickness of the positive electrode and overcoming the shortcoming that the initial value of the resistor is easy-dispersed. Besides, the cost of the conductive material taking the silver as the main component is lower than that of silver paste, and the amount of the conductive materials is less, thus effectively reducing the production cost of products, improving the market competitiveness of the products and being suitable for batch production.