The invention relates to a heat dissipation device for an electronic circuit module, comprising a substrate, a heat dissipation assembly and a casing. The casing is of a hollow structure and a runner is formed inside the casing, when a heat source is generated during the running of an electronic component of the substrate, heat is conducted to the heat dissipation assembly by the heat source and then conducted out of the device by generating heat convection in the casing when the heat passes through the runner. By virtue of the heat dissipation device, the electronic circuit module has a better heat dissipation effect.