The invention relates to a mutual non-solid-solution system metal infiltration process and device based ion implantation radiation damage. The process comprises the following steps of polishing and ultrasonic cleaning of pure tungsten metal, vacuum drying, silver metal plasma implantation, tungsten metal surface vacuum evaporation silver coating, vacuum drying, argon protection silver infiltration, hot-pressing infiltration supplementation, section scanning electron microscope (SEM) observation of a tungsten/silver composite metal material, section line scanning component analysis, Auger energy spectrum analysis of components along the material depth, welding strength test when the tungsten/silver composite metal material is used for spot-welding electrodes, and SEM observation of weldinghead tensile fractures. In the invention, a metal plasma implantation technology is utilized to combine with the vacuum evaporation technology, the high-temperature silver infiltration technology andthe hot-pressing infiltration supplementation technology, thus silver metal is successfully infiltrated to the surface of a metal tungsten workpiece to prepare the tungsten/silver composite metal material. Test results show that when a tungsten/silver composite metal material electrode is utilized to carry out resistance spot welding on a silver metal interconnection sheet and an aerospace craft solar cell sheet, the single-spot welding strength is up to 450gf which excesses Chinese military standard and current enterprise standard, and the welding head tensile fractures is determined to be ductile fractures through SEM analysis.