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发明公开
CN102141679A 用于封装一衬底的方法及装置 无效 - 驳回

用于封装一衬底的方法及装置
摘要：
本发明涉及用于封装一衬底的方法及装置。本发明揭示一种用于一干涉式调制器的封装结构及封装方法。在一干涉式调制器及透明衬底上沉积一薄膜材料来囊封所述干涉式调制器。该干涉式调制器与该薄膜之间的一间隙或空腔提供一使得该干涉式调制器的机械部件可在其中移动的空间。该间隙是通过移除一沉积于该干涉式调制器上的牺牲层来形成。
摘要（英）：

The present invention relates to a method and a device for packaging a substrate. The invention discloses a package structure and a method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and a transparent substrate to encapsulate the interferometric modulator. A gap or a cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.

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