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发明公开
CN102157482A 具有复合基材的电子系统 无效 - 驳回 复审申请

具有复合基材的电子系统
摘要：
本发明公开了一种具有复合基材的电子系统。该电子系统由电路板安置在金属框架上所构成，高发热的电子组件安置在金属框架上，低发热的电子组件安置在电路板上；芯片中的电路以金属线电性耦合至电路板上的电路。整个电子系统使用胶体封装以后，将金属框架的底面裸露出来提供散热用，使用本发明电子系统可以同时获得金属框架的优良散热性以及电路板的优良布线性。
摘要（英）：

A composite substrate made of a circuit board mounted on a lead frame is used for an electronic system package. High heat generated electronic components are adapted to mount on the lead frame and relatively low heat generated electronic components are adapted to mount on the circuit board. Metal lines are used for electrical coupling between the circuitry of the IC chip and the circuit board. An electronic system with the composite substrate gains both advantages-good circuitry arrangement capability from the circuit board and good heat distribution from the lead frame.

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