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CN102201385B 方形扁平无引线半导体封装及其制作方法 有权

方形扁平无引线半导体封装及其制作方法
摘要：
一种方形扁平无引线半导体封装及其制作方法，所述封装包含：晶粒附着垫，具有凹区；半导体晶粒，安装于晶粒附着垫的凹区上；一列内部端子引线，位于靠近晶粒附着垫的位置；多个第一焊线，用于将所述内部端子引线焊接至半导体晶粒；一列扩展的外部端子引线，位于沿着方形扁平无引线半导体封装外围的位置；一列中间端子，位于所述内部端子引线与所述扩展的外部端子引线之间；多个第二焊线，用于将所述中间端子焊接至半导体晶粒；多个第三焊线，用于将所述中间端子焊接至所述扩展的外部端子引线。上述封装及其制作方法，能够以较低成本封装表面贴装元件，使其产出率提高并使其占用印刷电路板的面积减少。
摘要（英）：

A quad flat non-lead (QFN) semiconductor package includes a die attach pad having a recessed area; a semiconductor die mounted inside the recessed area of the die attach pad; at least one row of inner terminal leads disposed adjacent to the die attach pad; first wires bonding respective said inner terminal leads to the semiconductor die; at least one row of extended, outer terminal leads disposed along periphery of the QFN semiconductor package; at least one row of intermediary terminals disposed between the inner terminal leads and the extended, outer terminal leads; second wires bonding respective the intermediary terminals to the semiconductor die; and third wires bonding respective the intermediary terminals to the extended, outer terminal leads.

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