The invention relates to a multi-circle arranged IC (integrated circuit) chip packaging member, which comprises a lead frame, inner pins, an IC chip and a plastic package body. The multi-circle arranged IC chip packaging member is characterized in that the lead frame is provided with a load; the inner pins of the lead frame are arranged around the lead frame in circles; the IC chip is provided with convex points; and the convex points are connected to the inner pins. Compared with a single-row lead frame with a same area, the multi-circle arranged IC chip packaging member has the advantage ofincreasing the number of the pins of the multi-circle arranged IC chip packaging member by over 40%; the pins can be connected with the lead frame without bonding wires; and the structure is simple and reasonable. In addition, as the heat conducting distance is short, the multi-circle arranged IC chip packaging member has better thermal property; as the convex points are in direct contact with the lead frame (a substrate, the chip), the inductance and the capacitance welded inside a circuit are reduced, the signal transmission speed is high, the distortion is little, and excellent electrical property is obtained; and the thickness and the weight of a package are reduced, thus reeling and disconnecting of a bonding wire are avoided, and the yield and the reliability for testing are improved.