The invention relates to an LED (light-emitting diode) packaging method, comprising the following steps: (1) planting an LED chip on a film-coated synthetic silicon substrate and leading a positive electrode and a negative electrode out of the bottom of the LED chip; (2) adopting a salient point/face printing plate mode for a metal carrier to protrude a positive electrode area and a negative electrode area; (3) placing the film-coated synthetic silicon substrate with the LED chip obtained in the step (1) on the metal carrier in the step (2), and enabling the positive electrode and the negative electrode of the LED chip to respectively correspond to the salient negative electrode area and the salient positive electrode area of the metal carrier, carrying out polarity connection between the positive and negative electrodes of the LED chip and the salient positive and negative areas of the metal carrier by adopting a silver paste bonding method; and (4) covering cuppy silicone covers between the film-coated synthetic silicon substrate and the metal carrier and at light-emitting positions of the LED chip, coating fluorescent powder on inner walls of the silicone covers, and packaging other parts between the film-coated synthetic silicon substrate and the metal carrier with resins. The invention also relates to an LED device which is packaged by using the packaging method.