The invention belongs to the technical field of die-cutting, forming and separating of integrated circuits and specifically relates to a die-cutting, forming and separating die for a DFN (dual-flat no-lead)/QFN (quad-flat no-lead) type flat integrated circuit without pins. The separating die comprises a framework-like fixed seat, wherein the top surface and bottom surface of the fixed seat are open, the middle part of the fixed seat is communicated with openings on the top surface and bottom surface of the fixed seat, and a closed discharge channel is enclosed at the middle part of the fixed seat; and a separating mechanism which is fixedly erected on the fixed seat and strides over the discharge channel is arranged at the upper part of the fixed seat. The separating die provided by the invention can not only meet the strength requirements of parts of the die, but also greatly provide a discharge space, meet the large-bath production demand of DFN/QFN type products, reduce the loss ofa knife edge part, shorten the maintenance time of the die, improve the production efficiency and simultaneously reduce the loss of spare parts.