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发明授权
CN102391532B 挠性印刷电路板基材用双向拉伸聚酰亚胺薄膜及制备方法 有权

  • 专利标题： 挠性印刷电路板基材用双向拉伸聚酰亚胺薄膜及制备方法
  • 专利标题（英）： Biaxially oriented polyimide film for flexible printed circuit board base material and preparation method of biaxially oriented polyimide film
  • 申请号： CN201110248294.6
    申请日： 2011-08-26
  • 公开(公告)号： CN102391532B
    公开(公告)日： 2012-11-14
  • 发明人: 朱宏清
  • 申请人： 朱宏清
  • 申请人地址： 江苏省无锡市江阴市公园路79号10幢
  • 专利权人： 朱宏清
  • 当前专利权人： 朱宏清
  • 当前专利权人地址： 江苏省无锡市江阴市公园路79号10幢
  • 代理机构： 江阴市同盛专利事务所
  • 代理商 唐纫兰; 曾丹
  • 主分类号： C08J5/18
  • IPC分类号： C08J5/18 ;  C08J7/00 ;  C08G73/10 ;  C08L79/08 ;  B29C41/24 ;  B29C41/52 ;  B29C55/14
挠性印刷电路板基材用双向拉伸聚酰亚胺薄膜及制备方法
摘要：
本发明涉及一种挠性印刷电路板基材用双向拉伸聚酰亚胺薄膜及制备方法。其特征在于：所述方法主要包括如下步骤：（1）聚合；按如下配比进行聚酰亚胺酸原液的制备:对苯二胺1-5%,联苯四甲酸二酐2-8%,二氨基二苯醚5-10%,均苯四甲酸二酐8-15%,二甲基乙酰胺62-84%；（2）流涎成膜；（3）纵拉；拉伸比为1：1.02~1.15；（4）横拉及亚胺化：拉伸比为1：1.05~1.2；（5）切边收卷；（6）后处理；（7）分切包装。本发明挠性印刷电路板基材用双向拉伸聚酰亚胺薄膜及制备方法，可以获得符合挠性印刷电路板基材使用要求的专用双向拉伸聚酰亚胺薄膜材料。
摘要（英）：

The invention relates to a biaxially oriented polyimide film for flexible printed circuit board base material and a preparation method of the biaxially oriented polyimide film. The method is characterized by mainly comprising the following steps of: (1) polymerizing: preparing a basic solution of polyimide acid according to the following proportions: 1-5% of p-phenylenediamine, 2-8% of biphenyltetracarboxylic dianhydride, 5-10% of diaminodiphenyl ether, 8-15% of pyromellitic dianhydride and 62-84% of dimethylacetylamide; (2) salivating the solution into a film; (3) longitudinally stretching the film according to the stretching ratio of 1:1.02-1.15; (4) transversely stretching the film according to the stretching ratio of 1:1.05-1.2 and carrying out imidization; (5) cutting the edge and rolling up the film; (6) postprocessing the film; and (7) cutting and packaging the film. The special biaxially oriented polyimide film material conforming to the flexible printed circuit board base material can be obtained by using the preparation method provided by the invention.

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