Disclosed is an adhesive resin composition which contains: an epoxy resin and/or a phenoxy resin; an epoxy-containing copolymer which is obtained by copolymerizing an epoxy-providing monomer and an ethylenically unsaturated monomer that is copolymerizable with the epoxy-providing monomer; a thermoplastic resin; and a curing agent. The epoxy-containing copolymer has a weight average molecular weight of 5,000 or greater but less than 100,000 and an epoxy equivalent of not more than 3,500 g/eq. The adhesive resin composition is capable of providing a one-pack type adhesive solution that is free from halogens and has excellent flame retardancy, excellent compatibility of polymer components, and excellent storage stability. Also disclosed are a laminate using the adhesive resin composition, and a flexible printed wiring board.