The invention relates to a multilayer single-face aluminum-based circuit board, which is characterized by being manufactured by using a method comprising the following steps of: (1) preparing an epoxy resin glue solution; (2) preparing nanometer inorganic composite filler; (3) preparing a high-heat-conduction insulated adhesive solution; (4) soaking glass fiber cloth in the high-heat-conduction insulated adhesive solution and drying to obtain prepregs; and (5) manufacturing the multilayer single-face aluminum-based circuit board: respectively manufacturing an inner layer board and an outer layer board from a plurality of prepregs manufactured in the step (4) and copper foils and aluminum plates according to a conventional general method, and laminating and pressing to obtain the multilayer single-face aluminum-based circuit board. The multilayer single-face aluminum-based circuit board has a favorable heat dissipation effect; when the weight part ratio of epoxy resin to the nanometer inorganic composite filler is 100: 45, the heat conduction effect of the insulated bonding layer is optimal; the nanometer inorganic filler is filled in the epoxy region adhesive instead of the common filler, the heat conduction effect of the insulated bonding layer is greatly promoted.