The invention discloses a bonding assembly, which comprises a first bonding part, a second bonding part and bonding agent. The first bonding part is provided with a glue containing groove, a glue filling hole communicated with the glue containing groove, an air exhausting hole and a circulating groove partially communicated with the glue containing groove. A flange is arranged between the glue containing groove and the circulating groove. The flange is provided with a circulating opening for communicating the glue containing groove and the circulating groove. Raised lines are also arranged in the position of the glue containing groove corresponding to the circulating opening so as to block the bonding agent in the glue containing groove to flow into the circulating groove. The bonding agent is filled by the glue filling hole and contained in the glue containing groove for bonding the first bonding part and the second bonding part together. The air exhausting hole is connected with the glue containing groove by the circulating groove. A gluing method for the above gluing assembly is further disclosed. The gluing method can prevent the air exhausting hole from communicating with the glue containing groove directly by setting the circulating groove which is partially communicated with the glue containing groove and by communicating the air exhausting hole with the glue containing groove by the circulating groove so as to prevent the bonding agent from overflowing out of the air exhausting hole and from blocking the air exhausting hole to improve the bonding effect.