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发明授权
CN102471637B 散热涂布剂及利用此散热涂布剂的散热板 失效 - 权利终止

散热涂布剂及利用此散热涂布剂的散热板
摘要：
本发明涉及在电气电子部件的散热板表面实现有效散热的散热涂布剂及利用此散热涂布剂的散热板，尤其涉及由红外线辐射体粉末和粘合剂构成并涂布于电气电子部件的散热板表面的散热涂布剂及利用此散热涂布剂在表面形成散热涂层的散热板。因此，在电气电子部件的散热板表面涂布辐射率高的高辐射率材料，从而提高散热饭的辐射率，以通过现有的对流和散热在散热板表面实现有效的散热，尤其是，涂布于电气电子部件中的LED光源的散热板表面，通过高辐射有效实现散热，从而实现高功率LED光源的实用化。
摘要（英）：

The present invention relates to a heat dissipation coating agent and to a heat-dissipating plate including same, which efficiently dissipate heat from the surface of a heat-dissipating plate of an electric/electronic component. Particularly, the heat dissipation coating agent, which is applied to the surface of a heat-dissipating plate of an electric/electronic component, includes infrared radiation powder and a binder, and the heat-dissipating plate is coated with a heat dissipation layer consisting of the heat dissipation coating agent. Since the heat dissipation coating agent applied to the heat-dissipating plate is highly conductive, heat is emitted from the heat-dissipating plate by conduction as well as convection. In particular, the heat dissipation coating agent, which conducts heat with high conductivity, can be applied to a heat-dissipating plate of a high-power LED light source.

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