The invention provides a high-isolation integrated circuit packaged by adopting a ceramic casing. The integrated circuit comprises a tube shell and a chip, wherein the tube shell comprises a shell bottom, a shell and a cover plate; and the chip is arranged on the shell bottom. The integrated circuit is characterized in that the shell comprises a first dielectric layer, a first metal base layer, asecond dielectric layer, a second metal base layer, a third dielectric layer and a third metal base layer which are sequentially overlapped from top to bottom; the chip is connected with the second metal base layer through a bonding wire; and the first metal base layer is connected with the third metal base layer through a first through hole. According to the integrated circuit provided by the invention, the coupling effect of a signal channel can be effectively reduced; the leakage of a local oscillator is reduced; the chip feeding frequency can be reduced; and work efficiency and economic benefit are increased; and the integrated circuit has the advantages of high isolation, simple system structure and favorable application prospect.