利索-全球专利检索

  1. 登录
  2. 注册
发明公开
CN102573674A 采用了减压的清创术切割头、方法和系统 无效 - 撤回

采用了减压的清创术切割头、方法和系统
摘要：
多种装置、系统以及方法涉及使用减压来将一部分组织定位在一个切割头中并切除该组织以便清理一个组织部位。一种切割头包括具有一个远端和一个近端的一个清创术导管。该清创术导管的与该远端毗连的一个部分包括一个组织处理区域。这种切割头还包括在该清创术导管的远端处形成的通往该组织处理区域的一个开口。这个组织处理区域被适配为在减压下通过该开口接收该部分的组织。这种切割头还包括在该组织处理区域处与该清创术导管相关联的一个选择性地可移动的切割构件。这个切割构件用于在该部分的组织停留在该清创术导管中时该部分的组织从该组织部位切除。在此还披露了其他的方法、系统、以及装置。
摘要（英）：

Apparatuses, systems, and methods involve using reduced pressure to position a portion of tissue in a cutting head and cutting the tissue to debride a tissue site. A cutting head includes a debridement conduit having a distal end and a proximal end. A portion of the debridement conduit adjacent to the distal end comprises a tissue treatment area. The cutting head also includes an opening to the tissue treatment area formed at the distal end of the debridement conduit. The tissue treatment area is adapted to receive the portion of tissue through the opening under reduced pressure. The cutting head also includes a selectively moveable cutting member associated with the debridement conduit at the tissue treatment area. The cutting member is for cutting the portion of tissue from the tissue site while the portion of tissue resides in the debridement conduit. Other methods, systems, and apparatuses are disclosed.

0/0