The invention provides a dispensing process for LED (light-emitting diode) encapsulation, which comprises of the following steps of: providing a carrier board which carries a plurality of LED elements; providing a sensor which senses the LED elements on the carrier board and makes sensing images and position parameters; setting the movement of a dispensing needle and the dispensing process according to the sensed imaged and the position parameters; performing the dispensing according to the movement of the dispensing movement and the dispensing process; and removing bad products on the carrier board. According to the invention, the dispensing process is carried out according to the sensed imaged and the position parameter sensed by the sensor, thus the yield rate is improved and the cost is reduced.