Disclosed is a substrate for a superconducting compound, said substrate achieving excellent adhesive strength and high orientation of copper at the same time. A method for manufacturing the substrate is also disclosed. In the method, the surface of a copper foil, which has been processed at a rolling reduction of 90% or more, is sputter-etched, and adsorbed materials on the surface are removed. A nonmagnetic metal plate is sputter-etched, and the copper foil and the metal plate are bonded with pressure by means of a mill roll. The laminated body thus bonded is heated and the copper is crystal-orientated, and at the same time, the copper is thermally diffused 10 nm or more in the metal plate, and a protection layer is formed on the copper surface of the laminated body.