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发明公开
CN102753347A 用于将流体喷射到基底上的设备和方法 有权

用于将流体喷射到基底上的设备和方法
摘要：
本文公开了如下设备和方法，所述设备和所述方法用于将流体（如受热流体）喷射到基底的所述表面上，然后局部地移除所喷射流体。所述设备可包括至少第一流体递送出口和第二流体递送出口，所述至少第一流体递送出口和所述第二流体递送出口彼此呈发散关系。所述设备可包括至少第一流体捕集入口和第二流体捕集入口，所述至少第一流体捕集入口和所述第二流体捕集入口分别相对于所述第一流体递送出口和所述第二流体递送出口局部地设置。所述设备和所述方法可用于（如）将流体喷射到两个会聚基底上，并且可用于加热所述基底的所述表面，以便促进所述基底彼此之间的熔融粘合。
摘要（英）：

Herein are disclosed apparatus and methods for impinging fluids, e.g. heated fluids, onto the surface of substrates and then locally removing the impinged fluid. The apparatus may comprise at least first and second fluid delivery outlets that are in diverging relation to each other. The apparatus may comprise at least first and second fluid capture inlets that are locally positioned relative to the first and second fluid delivery outlets, respectively. The apparatus and method may be used e.g. to impinge fluids onto two converging substrates and may be used to heat the surfaces of the substrates so as to facilitate melt-bonding the substrates to each other.

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