In an anisotropic conductive film formed by laminating an insulating adhesive layer containing a polymerizable acrylic compound, a film-forming resin, and a polymerization initiator and a conductive particle-containing layer containing a polymerizable acrylic compound, a film-forming resin, a polymerization initiator, and conductive particles, the insulating adhesive layer and the conductive particle-containing layer each contain a thiol compound in order not to decrease the adhesion strength to an adherend and to improve connection reliability. Examples of the thiol compound may include pentaerythritol tetrakis(3-mercaptopropionate), tris-[(3-mercaptopropionyloxy)-ethyl]-isocyanurate, trimethylolpropane tris(3-mercaptopropionate), and dipentaerythritol hexakis(3-mercaptopropionate).