The disclosed epoxy acrylate, acrylic composition, and cured substance are highly heat-resistant, exhibit little thermal expansion, and are useful in a solder resist resin, an electroless plating resin, a hard-coat material, a UV-curable coating, a glass-replacement material, a liquid-crystal color filter, or the like. The disclosed epoxy acrylate, which is represented by general formula (1), can be obtained by reacting a diepoxy phenyl compound with either acrylic acid or methacrylic acid. The disclosed composition contains said epoxy acrylate and a polymerization initiator. In the formula, Z represents a C1-6 alkyl group and a represents a number from 0 to 4.