A hot gas path component (10) is provided and includes a body (20) having a surface (21) and being formed to define a cavity (30), the cavity (30) employing coolant flow through a pin-fm bank (40) with coolant discharge through film-cooling holes (50) defmed on the surface (21), the pin-fm bank (40) including first and second pluralities of pin-fins (60, 70), the first plurality of pin-fms (60) and the second plurality of pin-fms (70) each being aligned with a determined flow streamline (80), and any two pin-fms of the first and second pluralities of pin-fms (60, 70) being separated from one another by a gap as a function of a film-cooling hole (50) dimension. A corresponding method of forming such a component is also provided.