The invention aims to provide a die exchange device for a no-frame type mold making machine in which a die for making a mold can be easily installed on a die base although the die is thick. The die carrying-in device (2) comprises: a first movable plate (33f) slidable toward a first die base (12f) in a die carrying-in direction (the direction of an arrow (X1)); and a second movable plate (33s) facing the first movable plate (33f) at a waiting position. Dies (11f, 11s) the positions of which are determined in a height direction are separated from the movable plates (33f, 33s) and are moved toward die bases (12f, 12s) by a die driving source so as to be held by clamp elements (14f, 14s). A cross driving source moves at least one of the first movable plate (33f) and the second movable plate (33s) independent of the other in a direction crossing a die insertion direction (the direction of the arrow (X1)).