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发明公开
CN103098191A 电子元器件安装体、电子元器件及基板 有权

电子元器件安装体、电子元器件及基板
摘要：
本发明提供的电子元器件安装体，在基板（6）上安装有包括多个元器件侧电极端子（3a，3b）的电子元器件（1），该基板包括与多个元器件侧电极端子（3a，3b）相对应的多个基板侧电极端子（7a，7b），其特征在于，包括：多个突起状电极（5a，5b），该突起状电极分别形成于电子元器件（1）的多个元器件侧电极端子（3a，3b）上且与电子元器件（1）及基板（6）电连接；假电极（3c），该假电极形成于电子元器件（1）上且与多个元器件侧电极端子（3a，3b）中的预定位置上的元器件侧电极端子（3a）电连接，与假电极（3c）电连接的预定位置上的元器件侧电极端子（3a）上的突起状电极（5a）比与上述预定位置不同的位置上的元器件侧电极端子（3b）上的突起状电极（5b）更高。
摘要（英）：

An electronic-component mounted body of the present invention has an electronic component (1), which is provided with a plurality of component-side electrode terminals (3a, 3b), mounted on a circuit board (6), which is provided with a plurality of circuit-board side electrode terminals (7a, 7b) corresponding to the plurality of component-side electrode terminals (3a, 3b). The electronic-component mounted body is provided with: a plurality of protruded electrodes (5a, 5b) that are formed on each of the plurality of component-side electrode terminals (3a, 3b) of the electronic component (1), and that electrically connect the electronic component (1) and the circuit board (6); and a dummy electrode (3c) that is formed on the electronic component (1), and that is electrically connected to a component-side electrode terminal (3a), among the plurality of component-side electrode terminals (3a, 3b), located at a prescribed position. The electronic-component mounted body is characterized in having the height of a protruded electrode (5a), formed on the component-side electrode terminal (3a) that is located at the prescribed position and that is electrically connected to the dummy electrode (3c), to be higher than a protruded electrode (5b) formed on a component-side electrode terminal (3b) located at a position different from the prescribed position.

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