The invention provides a method for processing beryllium copper plate strips for secondary electronic emission. The composition proportion of the sheet material comprises: by weight, 2.7-3.0 % of beryllium, 0.31% or less than 0.31% of nickel, 0.058% or less than 0.058% of ferrum, 0.013% or less than 0.013% of aluminum, 0.028 % or less than 0.028 % of silicon, 0.0020 % or less than 0.0020 % of plumbum, 0.0020 % or less than 0.0020 % of cadmium, 0.0020 % or less than 0.0020 % of zinc, and 0.43 % or less than 0.43 % of the sum of other impurity elements, and the balance copper. The particular rolling technology includes the steps: using methods of plasticization and extrusion to manufacture blanks; heating the blanks and preserving heat; matching with the middle annealing technology and acid-washing, conducting multi-pass rolling on a rolling machine; and after rolling is conducted, conducting corresponding heat treatment to obtain the sheet materials with corresponding standards. A secondary electronic emission peak value of beryllium copper plate and strip emitting can reach more than 10 which is far more than a level of a peak value which is 6.