A picking device of a ball grid array (BGA) repair workstation comprises a vacuum pump, a gas dryer, a vacuum generator and a chip picking suction nozzle, wherein the gas dryer, the vacuum generator and the chip picking suction nozzle are sequentially connected with the vacuum pump. The picking device further comprises a step motor, a pressure sensor and a programmable logic controller (PLC), wherein the step motor and the pressure sensor are connected with the chip picking suction nozzle, and the PLC is connected with the step motor and the pressure sensor. The PLC sends out instructions to the step motor and controls the step motor to lifting the chip picking suction nozzle, and the pressure sensor monitors the pull force for lifting chips in real time. The picking device of the BGA repair workstation mainly solves the problem of mechanical damage to BGA devices or printed circuit boards (PCBs) due to the situation that the pressure or the pull force provided by an existing picking device is not stable.