The invention discloses a scrap bounce prevention mold applied to the punching of light-emitting diode (LED) bracket. The mold comprises a convex mold (1) and a concave mold (2) matched with the convex mold (1), wherein a groove (3) which is recessed into the side wall inwards and is inclined to the central line of the side wall is formed in a side wall on one side of the concave mold (2); a groove which is recessed into the side wall inwards and is inclined to the central line of the side wall is formed in a side wall opposite to the formed groove; and the inclined direction of the groove is opposite to the inclined direction of the groove in the opposite surface. The scrap bounce prevention mold has the beneficial effects of being easy to operate, low in cost, wide in application range and good in scrap bounce prevention effect; as long as the scrap bounce prevention concave mold is arranged in the mold, the function can be realized, retreatment after grinding is not required, a vacuum pump and a scrap collecting device are not required to be mounted, the production cost is reduced, and the labor efficiency is improved.