A quick high-flexibility manufacturing method for a ceramic circuit board comprises the following steps: irradiating laser on the surface of a ceramic matrix, and controlling the energy density of the laser to reach above the fracture threshold of the chemical bond of the compound containing active ions, so that chemical reaction occurs on the surface of the ceramic matrix, an active substance is separated out to serve as a chemical plating catalytic source, and the active substrate generated by the reaction and the matrix form chemical metallurgical bonding, wherein different laser sources are selected aiming at different ceramic materials according to the chemical bond energy of the ceramic material components, and the laser energy is controlled to reach the ceramic modified threshold by controlling the average power of laser output, pulse repetition frequency, scanning speed, defocusing amount, space between scanning line and scanning times; and the ceramic matrix modified by the laser is placed into a chemical plating solution to perform plating to form a metal coating. The surface of the ceramic is modified by the laser, so that a metal conductive layer and the matrix form chemical metallurgical bonding, the bonding force of the circuit board is greatly increased, and the heat-conducting property and the electric property are improved.