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发明公开
CN103227162A 导线架及其封装构造 无效 - 驳回 复审申请

导线架及其封装构造
摘要：
本发明公开一种导线架及其封装构造，所述导线架包含一芯片承座及数个引脚，所述引脚环绕排列在所述芯片承座的至少一侧。所述导线架在进行封装的至少一接触表面上设有数个多角星形凹坑。本发明进行封装作业时，由于封装胶体可被填入所述多角星形凹坑内，因此可进一步增加所述导线架与封装体接触的总表面积，从而提高所述导线架及封装体的结合强度，防止分层现象，提高封装产品的可靠度及使用寿命。
摘要（英）：

The invention discloses a wire frame and a packaging structure thereof. The wire frame comprises a chip pedestal and a plurality of pins, wherein the pins are arrayed on at least one side of the chip pedestal in a surrounding manner, and the wire frame is provided with a plurality of multiangular star concave pits on at least one packaging contact surface. During packaging operation, packaging colloid can be filled in the multiangular star concave pits, so that a total surface area of the wire frame contacted with a packaging body can be increased, the bonding strength of the wire frame and the packaging body is improved, lamination is avoided, and the reliability and the service life of a packaging product are improved and prolonged.

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