This deposition method involves a preparation step for preparing a mask unit in which the relative position of a shadow mask (81) and a deposition source (85) is secured, a deposition step for depositing a deposition flow ejected from the deposition source (85) onto a deposition area (210) by relatively moving the mask unit and/or a substrate (200) to be formed with a film, and a shutter position adjusting step for adjusting the position of a second shutter (111) so as to shield the deposition flow flowing into an area (210) in which deposition is not needed.