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发明公开
CN103275590A 一种亚微米/微米银复合体系环氧树脂导电胶的制备方法 有权 转让

一种亚微米/微米银复合体系环氧树脂导电胶的制备方法
摘要：
本发明公开了一种亚微米/微米银复合体系环氧树脂导电胶的制备方法，首先制备亚微米/微米银复合体系，然后将环氧树脂、固化剂、助剂、亚微米/微米银复合体系等溶解在溶剂中，将反应物料经球磨后再固化，制得亚微米/微米银复合体系环氧树脂导电胶。本发明制备的亚微米/微米银复合体系环氧树脂导电胶可以进行中高温固化，复合体系导电胶的导电性能要优于单纯微米银体系导电胶的导电性能。本发明的方法工艺简单、条件温和、易实施。
摘要（英）：

The invention discloses a preparation method of a submicron/micrometer silver composite system epoxy resin conductive adhesive. The method comprises the following steps: preparing a submicron/micrometer silver composite system, dissolving an epoxy resin, a curing agent, an assistant and the submicron/micrometer silver composite system in a solvent, ball-milling reaction materials, and curing the reaction materials to prepare the submicron/micrometer silver composite system epoxy resin conductive adhesive. The submicron/micrometer silver composite system epoxy resin conductive adhesive prepared in the invention can undergo medium and high temperature curing, and the conductivity of the composite system conductive adhesive is better than the conductivity of a simple micrometer silver system conductive adhesive. The method has the advantages of simple process, mild condition and easy implementation.

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