A microelectronic assembly (100) is provided which includes a first element (110) consisting essentially of at least one of semiconductor or inorganic dielectric material having a surface (103) facing and attached to a major surface (104) of a microelectronic element (102) at which a plurality of conductive pads (106) are exposed, the microelectronic element (102) having active semiconductor devices therein. A first opening (111) extends from an exposed surface (118) of the first element (110) towards the surface (103) attached to the microelectronic element (102), and a second opening (113) extends from the first opening (111) to a first one of the conductive pads (106), wherein where the first and second openings meet, interior surfaces (121), (123) of the first and second openings extend at different angles relative to the major surface (104) of the microelectronic element (102). A conductive element (114) extends within the first and second openings (111), (113) and contacts the at least one conductive pad (106).