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发明公开
CN103378179A 光电元件封装体及可拆卸式封装结构 有权

光电元件封装体及可拆卸式封装结构
摘要：
本发明提供一种光电元件封装体及可拆卸式封装结构。光电元件封装体包括下板结构、上板结构、至少一光电元件及至少一导光元件。下板结构包括具有多个第一校准部的第一承载部以及配置在第一承载部上且具有多个第二校准部的第一基底部。上板结构包括具有多个第三校准部的第二承载部及配置在第二承载部上且具有多个第四校准部的第二基底部，且第一校准部搭配第三校准部以组合上板结构与下板结构。第二校准部搭配第四校准部以定位第一基底部与第二基底部。每一光电元件配置在第一基底部上。每一导光元件配置在第一基底部与第二基底部之间。一种可拆卸式封装结构也被提出。
摘要（英）：

A photoelectric device package and a detachable package structure are provided. The photoelectric device package includes a bottom-plate, a top-plate, at least one photoelectric device, and at least one light-guiding element. The bottom-plate has a first carrying part and a first substrate part on the first carrying part. The first carrying part has first alignment portions. The first substrate part has second alignment portions. The top-plate has a second carrying part and a second substrate part on the second carrying part. The second carrying part has third alignment portions. The second substrate part has fourth alignment portions. The top-plate and the bottom-plate are assembled by the first and third alignment portions. The first and second substrate parts are positioned by the second and fourth alignment portions. Each photoelectric device is disposed on the first substrate part. Each light-guiding element is disposed between the first and second substrate parts.

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