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发明公开
CN103426808A 用于临时键合的载片结构以及键合与拆键合方法 有权

用于临时键合的载片结构以及键合与拆键合方法
摘要：
本发明提供一种用于临时键合的载片结构，包括一载片晶圆，在载片晶圆上表面开有凹槽，所述凹槽的内壁以及所述凹槽四周的载片晶圆外圈上表面经过去粘性处理；填充胶填充在所述凹槽内并被固化；器件晶圆通过临时键合胶与固化后的填充胶上表面和载片晶圆外圈上表面键合，形成临时键合体。本发明还提供了该载片结构的键合与拆键合方法。本发明解决了现有载片晶圆制作工艺繁琐和成本昂贵等相关问题，很大程度实现了低成本的临时键合工艺，同时保证了拆键合的可靠性，降低碎片的风险。
摘要（英）：

The invention provides a slide structure for temporary bonding. The slide structure comprises a slide wafer, a groove is formed in the upper surface of the slide wafer, and viscosity removal treatment is performed on the inner wall of the groove and the upper surface of the outer circle of slide wafer surrounding the groove; filling glue is filled into the groove and solidified; a device wafer is in bonding with the upper surface of the solidified filling glue and the upper surface of the outer circle of the slide wafer to form a temporary bonding body. The invention further provides a method for bonding and bonding removal of the slide structure. The slide structure for temporary bonding and the method for bonding and bonding removal solve the related problems that an existing slide wafer is complicated in manufacturing process, high in cost and the like, achieve the low-cost temporary bonding process to a large extent, meanwhile, guarantee reliability of bonding removal, and reduce fraction risks.

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