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发明授权
CN103440874B 利用子基座条制造激光二极管单元的装置和方法 有权

利用子基座条制造激光二极管单元的装置和方法
摘要：
本发明的激光二极管单元的制造方法包括步骤：将激光二极管置于形成子基座的安装面的焊料构件之上；将加压载荷施加于激光二极管，并将激光二极管压向焊料构件；接着，在所述焊料构件被施加加压载荷的同时，通过对焊料构件以高于焊料构件的熔点的温度进行加热，使焊料构件熔融，其后，通过冷却并焊料构件使其固化，将激光二极管接合于子基座，其后，解除加压载荷；以及在已经除去加压载荷之后，通过以低于焊料构件的熔点的温度对焊料构件进行加热，使固化了的焊料构件软化，其后，冷却焊料构件并使其再固化。
摘要（英）：

A manufacturing method of laser diode unit of the present invention includes steps: placing a laser diode on top of a solder member formed on a mounting surface of a submount, applying a pressing load to the laser diode and pressing the laser diode against the solder member, next, melting the solder member by heating the solder member at a temperature higher than a melting point of the solder member while the pressing load is being applied, and thereafter, bonding the laser diode to the submount by cooling and solidifying the solder member, thereafter, removing the pressing load, and softening the solidified solder member by heating the solder member at a temperature lower than the melting point of the solder member after the pressing load has been removed, and thereafter cooling and re-solidifying the solder member.

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