The invention provides a dual-optical-path optical imaging system of an LED wire bonding machine. The dual-optical-path optical imaging system comprises a base for lens assemblies and an electronic sensitization device to be installed. The base is provided with a cavity, a partition plate capable of partitioning the cavity into two long grooves is arranged at the center of the cavity, and one lens assembly is respectively installed in the long grooves. A stopping block is further arranged in the cavity. The base is further provided with a sliding device capable of enabling the stopping block to slide in the direction perpendicular to the extending directions of the long grooves. An optical-path inlet is respectively arranged in the front end of each long groove, and the rear end of the cavity is an optical-path outlet. A receiving region of the base is located behind the optical-path outlet, and the electronic sensitization device is installed in the receiving region. The dual-optical-path optical imaging system can meet different production tasks and requirements after being only installed and debugged in one time, the production cost is reduced, and the production efficiency is improved. The imaging quality is improved, the imaging contrast ratio is improved, and image processing is facilitated. The production efficiency of the wire bonding machine is improved, imaging of target objects which are not located in the same field-depth range is achieved through dual optical paths, and twice focusing of a single optical path is omitted.