The invention discloses an electronic element encapsulation structure and method. The method includes: providing a circuit board which comprises a substrate and a first conducting pattern; configuring an electronic element with an electrode on the circuit board; forming a dielectric layer on the circuit board to cover the electronic element, the electrode and the first conducting pattern, wherein the first conducting pattern forms a first recess pattern on the dielectric layer; patterning the dielectric layer to form a through hole and a second recess pattern communicated with the through hole and exposing the electrode; filling conducting materials into the through hole and the second recess pattern so as to form a conducting through hole in the through hole and a second conducting pattern in the second recess pattern; removing the substrate; respectively forming a first solder mask layer and a second solder mask layer on the first conducting pattern and the second conducting pattern. In addition, an electronic encapsulation structure is provided. Due to the fact that electronic element is embedded in the dielectric layer, the overall thickness of the electronic element encapsulation structure can be reduced greatly.