The invention relates to a printed circuit board copper surface microetching and coarsening method and equipment thereof. In the present circuit board manufacturing industry, liquid waste emissions of each production line in a copper surface coarsening technology are all more than 30 tons monthly, and 800 kilograms of waste copper contained in 30 tons of the liquid waste discharged monthly cannot be recycled efficiently. The printed circuit board copper surface microetching and coarsening equipment comprises a main microetching tank, an attached plating tank, circulation loops and a power supply. The main microetching tank and the attached plating tank are connected and communicated with each other through two circulation loops. The main microetching tank and the attached plating tank are both filled with a microetching liquid medicine. At least an anode titanium plate and at least a cathode titanium plate are arranged in the attached plating tank, wherein the anode titanium plate is electrically connected to the positive electrode of the power supply; the cathode titanium plate is electrically connected to the negative electrode of the power supply; and lower ends of the anode titanium plate and the cathode titanium plate both extend into the microetching liquid medicine. Through cyclic utilization of the microetching liquid medicine and electrolytic recovery of microetching waste copper, industrial wastewater discharge is minimized remarkably, and wasting of copper resources is avoided.