The invention discloses an integrated circuit. The integrated circuit comprises a package body, a plurality of interface connectors, a function chip and an ESD protection chip, wherein the interface connectors are arranged on the outer surface of the package body; the function chip is provided with an electronic function circuit, and the ESD protection chip is provided with ESD protection circuits; the ESD protection circuits are electrically connected with the interface connectors as data exchange paths. The designing scheme of the integrated circuit ensures that process selecting and circuit designing are flexible, and thus the cost can be lowered relatively.