The invention refers to a polyamide molded composition with high heat/ light aging resistance, a method for producing products, application based on ethylene and butene copolymer and products obtained from the application. Molding composition comprises combination of (A) 38-90 wt.% of at least one polyamide with a viscosity number (VN) of 130-160 ml/g according to DIN EN ISO, (B) 5-45 wt.%, preferably 7-40wt.%, and more preferably 10-20 wt.% of at least one type of glass fibers, and (C) 5-17 wt.%, preferably 8-15 wt.%, of an impact modifier based on copolymers of ethylene and butylene, which are functionalized via reaction with maleic anhydride or with graft copolymers with an unsaturated dicarboxylic anhydride or dicarboxylic acids and/or ester, preferably maleic anhydride, itaconic acid or itaconic anhydride, fumaric acid or maleic acid, wherein the total sum of the weight percentage of A,B and C is 100.