The invention relates to a thin-film switch and a manufacturing method thereof. The thin-film switch comprises an upper layer thin film, a lower layer thin film and a middle isolation layer. Holes which correspond to upper conducting points and lower conducting points in position are formed in the isolation layer, and the isolation layer is bonded to the upper layer thin film and the lower layer thin film through glue coated to the upper surface and the lower surface of the isolation layer, wherein the glue on the upper surface or/and the lower surface is hot melt glue. In order to manufacture the thin-film switch, the manufacturing method comprises the following steps: (a) coating the glue to the upper surface or/and the lower surface of the selected isolation layer except the holes; (b) respectively bonding one faces, printed with the conducting points and conducting circuits, of the upper layer thin film and the lower layer thin film, and bonding the upper layer thin film and the lower layer thin film to the isolation layer through the glue, wherein the conducting points and the holes correspond in position. The hot melt glue is coated to the upper surface or/and the lower surface of the isolation layer, and thus, the defects, bubbles, transparency, hungry joint and the like, caused by the traditional printing technology can be effectively overcome; the liquid glue is prevented from being ineffective; the production process of the thin-film switch is simplified; the degree of automation is improved; the human cost is reduced.