The invention provides a wave-soldering brazier device which comprises a tin liquor driving zone, a wave-soldering zone and a tin slag treatment zone. The tin liquor driving zone is provided with a tin liquor driving device which is used for driving tin liquor to the wave-soldering zone. The wave-soldering zone is provided with a jet device and a guide device, the jet device is used for enabling the tin liquor to form a wave crest and welding a circuit board bearing an electronic component, the guide device comprises a guide groove formed by a bottom face and three side faces, an opening is formed in one end of the guide groove, the bottom face of the guide groove gradually rises to form a slope face from the opening end of the guide groove to the other end of the guide groove, and a drainage blocking sheet is arranged at the opening end of the guide groove and used for guiding the tin liquor and tin slag to flow to the tin slag treatment zone. The tin slag treatment zone is provided with a tin slag treatment device used for treating the collected tin slag. According to the wave-soldering brazier device, the floating tin slag spread all around is removed, and tin slag treatment efficiency is greatly improved.