Disclosed is a stacked chip module, a manufacturing method and a maintenance method of the same. The stacked chip module has integrated circuit chip integrated circuit (IC) chips having integratable built-in self-maintenance blocks. The module comprises a stack of chips and each chip comprises a self-maintenance block with first and second controllers. The first controller controls wafer-level and module-level servicing (e.g., self-testing or self-repairing) of an on-chip functional block. The second controller provides an interface between an off-chip tester and the first controller during wafer-level servicing. Each chip further comprises a plurality of interconnected structures (e.g., multiplexers and through-substrate-vias) that integrate the self-maintenance blocks of adjacent chips in the stack so that, during module-level servicing, a single second controller on a single one of the chips in the stack (e.g., the bottom chip) provides the only interface between the off-chip tester and all of the first controllers.