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发明公开
CN103779238A 封装制作工艺 无效 - 撤回

封装制作工艺
摘要：
本发明公开一种封装制作工艺。提供一封装母板。封装母板具有彼此相对的一上表面与一下表面、一元件配置区以及一围绕元件配置区的周边区。封装母板的上表面上已设置有多个半导体元件。半导体元件位于元件配置区内。提供一承载板。承载板具有一中心区与一围绕中心区的边缘区。形成一粘着层于封装母板的周边区与承载板的边缘区之间。承载板的中心区与封装母板的元件配置区对应设置。承载板的边缘区与封装母板的周边区对应设置。粘着层呈半固化态，且封装母板通过粘着层与承载板相对接合。进行一烘烤步骤，以完全固化粘着层。
摘要（英）：

A packaging process is provided. A package mother board having an upper surface, a lower surface, a device disposing area and a peripheral area surrounding the device disposing area is provided. Multiple semiconductor devices are disposed on the upper surface. The semiconductor devices are located in the device disposing area. A carrier having a center area and an edge area surrounding the center area is provided. An adhesive layer is formed between the peripheral area and the edge area. The center area of the carrier is disposed corresponding to the device disposing area of the package mother board. The edge area of the carrier is disposed corresponding to the peripheral area of the package mother board. The adhesive layer is in a state of semi-curing, and the package mother board is bonded to the carrier via the adhesive layer. A baking process is performed to completely cure the adhesive layer.

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