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发明公开
CN103804792A 一种导热反光型热塑性模塑材料及其应用 无效 - 驳回

一种导热反光型热塑性模塑材料及其应用
摘要：
一种导热反光型热塑性模塑材料及其应用，涉及导热反光材料的开发及应用。该材料，包括热塑性树脂、导热性填料及反光性填料，按重量份，热塑性树脂占4-8份，导热性填料占3-5份，反光性填料占3-5份；热塑性树脂选自PP树脂、PEA树脂、PPA树脂、PA树脂、PC树脂及PBT树脂中的任意一种。其应用，用该材料成型LED电路板的基板，也可用该材料成型导热反光型器件。该LED基板具有良好的导热性及反光性，其导热系数一般能达1.7W/m.℃左右，白度大于90。电绝缘性好，其表面电阻超过1012欧姆/平方厘米，完全能达到LED基板的电绝缘要求。易于成型。用本发明材料制作的LED基板具有高导热、高反光、电绝缘性好、易成型及低成本的特点，具有市场竞争力。
摘要（英）：

The invention discloses a heat-conductive and light-reflective thermoplastic molding material and application thereof, relating to the development and application of heat-conductive and light-reflective materials. The material contains the following ingredients in parts by weight: 4-8 parts of thermoplastic resin, 3-5 parts of heat-conductive filler and 3-5 parts of light-reflective filler, wherein the thermoplastic resin is any one selected from PP (Polypropylene) resin, PEA (Phenylethylamine) resin, PPA (Phenylpropanolamine) resin, PA (Polyamide) resin, PC (Polycarbonate) resin and PBT (Polybutylene Terephthalate) resin. According to the application, the material is used for molding a substrate of an LED (Light Emitting Diode) circuit board and can also be used for molding heat-conductive and light-reflective devices; the LED substrate has good heat conductivity and light reflectivity, the coefficient of heat conductivity can reach about 1.7W/m.DEG C generally, and the whiteness is greater than 90; the electrical insulating performance is good, and the surface resistance exceeds 1,012 ohm per square centimeter, so that the requirements of the LED substrate for electric insulation can be fully met; the molding process is easy; the LED substrate produced by using the material disclosed by the invention has the characteristics of high heat conductivity, high light reflectivity, good electrical insulating performance, easiness in molding and low cost, thereby having market competitiveness.

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